

IBM CPO
Overview :
IBM's next-generation Co-Packaged Optics (CPO) technology is a groundbreaking optical solution designed to connect chips, circuit boards, and servers within data centers using light instead of electricity. This enhances bandwidth, reduces energy consumption, and accelerates the training and operation of AI models. CPO technology significantly increases communication bandwidth in data centers, reduces GPU idle time, and dramatically speeds up AI processing. It represents a new paradigm in data center communication, helping to meet the growing energy and processing demands of generative AI.
Target Users :
The target audience includes data center operators, AI researchers, and enterprise IT decision-makers. This technology is suitable for them as it significantly enhances communication and energy efficiency in data centers, accelerates the training and deployment of AI models, while also reducing costs and environmental impact.
Use Cases
Data center operators utilizing CPO technology have significantly enhanced data processing speed and energy efficiency.
AI research teams have leveraged CPO technology to reduce the training time of large language models from three months to three weeks.
Enterprise IT departments have achieved a light-speed upgrade in data center communication through the deployment of CPO technology, reducing energy consumption.
Features
? Offers over 5 times the improvement in energy efficiency, reducing energy consumption per bit to less than one picojoule compared to medium-range electrical interconnect technologies.
? Accelerates the training speed of large language models (LLM) by up to 5 times, shortening training time from three months to three weeks.
? Saves energy equivalent to the annual electricity consumption of 5,000 American households for each AI model trained.
? Provides 80 times the current bandwidth for inter-chip communication.
? Achieves high-bandwidth density interconnects between chips by adding optical paths to electronic modules.
? Enables the addition of six times the current optical fiber capacity at the edges of silicon photonic chips, referred to as 'Seaside Density.'
? Implements high-density optical channels through PWG technology with 50-micron spacing, coupling with silicon photonic waveguides via standard assembly packaging processes.
How to Use
1. Understand the basic principles and advantages of IBM CPO technology.
2. Evaluate the current communication architecture and upgrade needs of the data center.
3. Collaborate with IBM to design a CPO solution tailored for the data center.
4. Deploy CPO modules in the data center, replacing or upgrading existing electrical interconnects.
5. Monitor and optimize the performance of CPO technology to ensure efficient and stable communication.
6. Regularly assess energy consumption and cost savings to ensure a return on investment for CPO technology.
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